PCB design and simulation
High-speed mixed-signal layout with sensitive analoge circuitry
Impedance calculation/Stackup planning in close contact with PCB-manufacturer
Digital signal integrity simulation with HyperLynx SI
FPGA IO Optimization, connecting FPGA design code and physical electronics
Schematic capture in Mentor Graphics DxDesigner
RF structure design in Mentor Graphics Xpedition Layout
Thermal analysis of heat flow in PCB structures in Exposed paddle area
Check of integration electronics/mechanics (collaboration ECAD/MCAD designers)
The Electronics Realisation group is responsible for designing PCB's and all electronic assembly tasks (PCB's, cables, racks, cryogenic setups etc).
Our skilled PCB designers use Mentor Graphics Xpedition software for the creation of a wide range of PCB technology. Amongst these are circuits for very high reliability (for use in space), high-speed digital, radio frequency (RF), cryogenic and mixed technology (analog/digital) systems. They are for use in situations such as detector electronics (flight), test setups and RF projects. We have extensive knowledge about the thermal, mechanical, electrical and EMC behaviour of these circuits. Detailed simulations using software such as MG Hyperlynx are used to evaluate designs before committing to hardware.
PCB assembly and integration
Populating a Printed Circuit Board (PCB) on a Semi-Automatic Pick&Place
UV-LED PCB, part of Soft X-ray Spectrometer (SXS) ASTRO-H Space Mission
Custom cable assembly (low and high voltage) on Flight Model of ASTRO-H
FEE TROPOMI detail of FPGA board (flex-rigid-PCB)
Radiation Tolerant Front End Electronics (FEE) for TROPOMI Space Mission
A milled/drilled prototype PCB, using SRON-equipment
Modification on PCB by soldering two 0402 resistors (0,5x1mm) on IC
Frame Processing Unit (FPU) for SPEX-Airborne
Overview of manufactured RF Modules (1~12 GHz)
4-8 GHz Up/Down Converter for Readout of Kinetic Inductance Detectors (KID)
PCB's are assembled by our trained and certified personnel. They either use hand soldering or our surface mount process, which consists of a screen printing machine, a semi-automatic pick and place machine, and a vapour phase oven. We also use specialised equipment for leadforming, bonding, inspection and de-golding, and this all takes place in our high specification cleanroom rated at ISO class 7. Specific areas are rated at ISO class 5. We also build racks, assemble cable harnesses, and support our projects with many original solutions.
Cryogenic wiring and assemblies
XIFU 40-pixel experiment
Close-up of XIFU 40-pixel experiment
160 pixel array experiment that uses a Helmholtz coil
Cryogenic wiring: 12 pairs superconducting Niobium/Titanium, diameter per wire: 0,1mm
Detail of loom-wire assembly, wires are soldered with the aid of a microscope
Large coil for testing magnetic shielding in a cryostat (l=300mm D=125mm)
A light-tight setup for testing sensors in a cryostat (here without cover)
Rotatable SQUID device for testing influence of magnetic fields
Manual assembly of Helmholtz coil: insulating the coil's body
Manual assembly of Helmholtz coil: 2 x 600 windings of superconductive wire
Manual assembly of Helmholtz coil: ready for use in cryostat
For our cryogenic detector research, many creative and leading edge techniques are needed. For example, we develop special solutions for loom wiring and its connections, coils with thinner than 100µm wire and over 1500 windings, brackets with integrated temperature sensors, or bonded SQUIDs. Our assembly team has a great deal of experience in these fields.
Please take a look at our PCB design and assembly capabilities.